Additives are specialty chemicals that are added to base-chemistries to improve performance. These additives are often blended into the epoxy molding compounds, silicones, epoxy coating powders and other polymers to improve some aspect of performance. KRAYDEN offers a range of specialty additives to be used in our own chemistries or they can be used to improve the performance of your own materials.
Additives
Performance Enhancing Additives
Additives
80 products

A1050 | Anti bleed Additive
- Silver filled systems
- 100 mPa-s Viscosity
- Non halogenated

A6165 | Electrical conductivity Enhancer
- Improves electrical conductivity
- Soluble in most resin systems
- May improve thermal conductivity

PEM-665 | Methacrylate terminated polyester
- Low color
- Low shrinkage
- Thermal stability

MM304 | Methacrylate adhesion promoter Additive
- Mild pleasant odor
- Hydrolytic resistance
- Lower weight loss on cure than IBOMA

MM220 | Mono-acrylate monomer
- Low Viscosity
- Low weight loss on cure
- Minimizes cure shrinkage

Benzimidazole CAS #51-17-2
- Enhanced Thermal Stability
- Versatile Chemical Base
- Corrosion Protection

CS-783 | Methacrylated Epoxy Functional Hybrid Cyclosiloxane
- Low viscosity
- Dual cure mechanism
- Multifunctional

U-847 | Dimer Diisocyanate Urethane Dimethacrylate
- Low color
- Low cure shrinkage
- BPA-free


BONDERITE C-IC DEOXIDOZER
- Aluminum Deoxidizing, Desmutting, Etching
- Prepares for Chromating
- 1 to 10 Minute Application Rate


BONDRITE C-AK MIL-ETCH
- Fine Satin or Frosted Etch on Aluminum
- Low-Foam Alkaline Formulation
- Scale- and Sludge-Reducing Sequestering Chemistry




BONDERITE C-AK 4316
- Heat-Scale Conditioning for Multiple Alloys
- Lower-Temperature Molten-Salt Bath Processing
- Nonflammable Titration-Controlled Bath Maintenance


BONDERITE M-ED 1000
- Nickel Acetate-Based Sealing Process
- Reduced Smut, Powdering, and Yellowing
- Commercial and Selected Military Anodizing Seal Processes

BOSTIK BOSCODUR
- Solvent-Resistant Urethane Bonding
- Effective Cross-Linker for Nitrile
- 4 to 6-Hour Working Window

CONAP DS-1831A
- 15% Red Pigment Concentrate
- Epoxy and Polyurethane System Compatibility
- Filled and Unfilled Formulation Guidance


COOLTHERM 6250
- 350 cP Low-Viscosity Curing Agent
- High-Solids Adhesive/Encapsulation Curing Agent
- Chemical-Resistant Cured Epoxy Systems


COOLTHERM 6732
- Hardener Component Thermal Interface Material
- 100:0.5 Controlled Mixing
- Thermally Conductive Thermal Interface


COOLTHERM 6733
- Solvent-Free RTV Silicone Encapsulation
- Low-Stress No-Exotherm Room-Temperature Cure
- -60 to 205 deg C Continuous Service


COOLTHERM EP-6010
- 55 cP Application Viscosity
- Low-Shrinkage Epoxy Curing Agent
- Two-Year Shelf Life at 25 deg C


COOLTHERM SC-6730
- Room-Temperature Thick-Section Cure
- 3.0 to 10.0% Mix Concentration
- Blue-Green Visual Mix Indicator


DOWSIL 3-6559
- Adjustable 1 to 5 Wt% Addition Level
- 4 to 12-Hour Cure Window
- Surface/Environment Cure-Inhibition Management


DOWSIL FS1265
- 100% Active Fluorosilicone Foam Control
- Chlorinated-Solvent-Insoluble Foam-Control Formulation
- 300/1,000/10,000 mm^2/s Viscosity Grades


DOWSIL Q2-1346
- Low Sodium and Potassium Impurity Limits
- Clear Liquid Supplied Free from Suspended Matter
- Long 900-Day Shelf Life


DOW XR-1541
- E-Beam Patternable, Negative Tone
- Etch Resistance Surface Treatment
- High Purity Surface Treatment

CONAP DS-1832
- Black Epoxy/Polyurethane Color Concentrate
- 18% Heat-Stable Black Pigment
- Filled/Unfilled Resin Addition Ranges

CONAP DS-1833
- Blue Epoxy/Polyurethane Color Concentrate
- 50% Heat-Stable Blue Pigment
- Filled/Unfilled Resin Addition Ranges

EPIBOND 1210
- Low-Outgassing Epoxy Bonding
- 50 to 75-Minute Working Window
- Flexible Cured Adhesive

ARALDITE TDR 1100-11
- Glass, Plastic, and Wood Bonding
- 2:1 Meter-Mix Processing
- 90-Minute Working Window

HARDENER HW 8680
- 225% Cured Elongation
- Polycarbonate, Nylon, and Primed-Metal Bonding
- 1:1 Mix with 15-Minute Open Time

HARDENER HY 5049
- High-Strength Structural Bonding
- Documented Water/Ice/Tropical-Climate Resistance
- Transparent Cured Bondline

INSULCURE 11B
- Heat-Curing INSULCAST Epoxy Curing Agent
- 700 cP Application Viscosity
- 3-Hour 100 deg C Cure


LOCTITE CAT 14
- Powdered Anhydride Epoxy Hardener
- Long Epoxy Working Life
- 3-Hour Cure at 150 deg C


LOCTITE CAT 15
- Liquid Polyamide Epoxy Hardener
- Two-Hour Pot Life
- 80 deg C Accelerated Cure


LOCTITE CAT 15 LV
- Low-Viscosity Epoxy Hardener
- 120-Minute Working Time
- Rigid/Semi-Rigid/Flexible Epoxy Systems


LOCTITE CAT 17M-1
- Anhydride-Based Epoxy Hardener
- Non-Flammable Curing Agent
- Electronic/Industrial Resin Systems


LOCTITE CAT 21
- Low-Viscosity Polyoxyalkylene Amine Curative
- One-Hour Pot Life
- Large-Mass Epoxy Castings


LOCTITE CAT 23LV
- Low-Viscosity Polyamine Epoxy Catalyst
- Water-Soluble Curing Agent
- Low-VOC Amber Liquid


LOCTITE CAT 24LV
- Low-Viscosity Epoxy Curing Agent
- Long Epoxy Pot Life
- Low-Temperature Cured Epoxy Performance


LOCTITE CAT 27-1
- Low-CTE Cured Epoxy
- Two-Hour Working Time
- Chemical-Resistant Cured Epoxy


LOCTITE CAT 43
- Liquid Polyamine Epoxy Catalyst
- Chemical-Resistant Cured Systems
- LOCTITE Encapsulant Compatibility


LOCTITE CAT 50-2
- Low-Viscosity Liquid Catalyst
- Dibutyltin Dilaurate Chemistry
- Consistent Catalytic Activity


LOCTITE CAT B97
- Low/Medium-Viscosity Epoxy Catalyst
- Encapsulation and Potting Systems
- Adhesion and Electrical Insulation


LOCTITE CAT9
- Modified Aliphatic Amine Hardener
- Chemical-Resistant Cured Epoxy
- -40 to 130 deg C Service


LORD 304-2
- High-Viscosity Placement Control
- Rubber, Wood, and FRP Bonding
- Durable Cured Performance with Environmental


LORD 306-2
- 306-1 Epoxy Hardener
- 1 to 2-Hour Working Time
- 24 to 48-Hour Room-Temperature Cure


LORD 3135-B
- Former Lord 7111-B Hardener
- Low-Shrinkage Epoxy Bonding
- Room-Temperature or Accelerated Heat Curing


BONDERITE L-AD 42
- Organosilicone Surfactant Foam Control
- Free-Rinsing Low-Residue Chemistry
- Polymer, Adhesive, and Latex Foam Control


BONDERITE S-AD 103
- Acid-Bath Corrosion Inhibition
- Direct Liquid Addition to Acid Baths
- Industrial Metal-Cleaning Bath Support

BOSTIK NSBT-16
- Copper-Graphite Anti-Seize Protection
- Up to 1800 deg F
- Brush-Top Assembly Application

BOSTIK NSBT-16N
- Copper-Free High-Temperature Protection
- Seizure and Galling Control
- Aggressive-Service Assembly Lubrication

BOSTIK NSBT-8N
- Copper-Free Pure-Nickel Protection
- Severe-Service Assembly Protection
- Compact 8 oz Package


COOLTHERM EP-6252
- Defined Epoxy Hardener Component
- Electrical Encapsulation System Use
- Component-Level Metering Control

ELANTAS UF-3
- Room-Temperature Foam Cure
- Expanding Electronic Void Fill
- Assembly-Conforming Foam Packaging


ENTHONE 20/A
- Two-Hour Mixed-Ink Pot Life
- Ambient or Heat Cure
- Permanent Marking Application Flexibility


ENTHONE 45
- M- and 50-Series Compatibility
- Catalyst-Selected Cure Control
- Permanent Marking System Integration


ENTHONE 77
- Ambient or Heat-Cure Choice
- One-Hour Ink Pot Life
- Heat-Enhanced Adhesion Development


ENTHONE AD2003
- Extended Marking-Ink Open Time
- Incremental 3 to 6% Addition
- In-Process Machine-Marking Adjustment


ENTHONE AD3002
- Two to Four Percent Flow Adjustment
- Crawling and Pinholing Control
- Gentle Post-Induction Mixing


ENTHONE B13/28
- Accelerated Three-Day Ambient Cure
- One-Hour Processing Window
- Nonconductive Black Ink Compatibility


ENTHONE B3
- Four-Hour Ink Pot Life
- Controlled Heat-Cure Processing
- Faster Cure at Higher Temperature


LOCTITE UK3184
- UK 3173 System Hardener
- 45-Minute System Work Time
- 24-Hour Room-Temperature Cure

PERMABOND 41
- 30-Minute On-Part Life
- Brush, Wipe, or Spray
- No-Mix Acrylic Initiation

PERMABOND 43
- 10 mPa s Low Viscosity
- 30-Minute On-Part Life
- Immediate No-Mix Assembly

PERMABOND 46
- No-Mix Surface Activation
- Two-Hour Assembly Window
- Low-Viscosity Controlled Application

A1100 | Anti bleed Additive
- 0.5%-1% wt
- Metal surfaces
- Excellent bleed control

A304 | 4-META adhesion promoter Additive
- Dental Applications
- Adhesion promoter
- Methacryloxyethyl trimellitic anhydride

A478-M | PMDM-M adhesion promoter Additive
- Dental Applications
- Adhesion promoter
- Pyromellitic Dianhydride Dimethacrylate

A6225| Anti bleed Additive
- Universal additive
- Reduces bleed out on metal surfaces
- Non halogenated

A6280 | Anti bleed Additive
- Use in Non-metal-filled systems
- Excellent bleed control on Gold surfaces
- Non halogenated

A675-100 | PMDGM adhesion promoter Additive
- Versatile
- Adhesion promoter
- Pyromellitic Dianhydride Glycerol Dimethacrylate Adduct
Chemlinq AL20-2B | Triethylenetetramine (TETA)
- Epoxy crosslinking hardener
- Soluble in polar solvents
- Colorless

CS-697 | Polyglycidyl Ether Cyclosiloxane
- Low viscosity
- Compatible with organic resins
- For formulating adhesives

Dow Corning Toray SF-8421-EG Fluid
- Epoxy Mold Compound (EMC) additive
- Formulated for compatibility with EMC
- Internal release agent for EMC

MM-204 High Tg Mono-Functional Acrylate Monomer
- Hydrolytically resistant
- Low Viscosity
- High Glass Transition Temperature (Tg)

MM211 | Maleimide adhesion promoter Additive
- Adhesion promoter
- Flexible aliphatic backbone
- Maleimide and carboxylic groups

MM281 | Maleimide adhesion promoter Additive
- Adhesion promoter
- Flexible aliphatic backbone
- Long Alkyl chain

MM290| Acrylate adhesion promoter Additive
- Mild pleasant odor
- Hydrolytic resistance
- Lower weight loss on cure than IBOA

PEAM-1044 Low warpage Polyester Acrylate/Methacrylate
- Thermally stable
- Low warpage
- High adhesion to various substrates

PEAM-1769 Difunctional (meth)acrylate
- Ultra low modulus
- Thermal stability
- High adhesion to various substrates

PEAM-645 High Tg Polyester Acrylate/Methacrylate
- High Tg
- Low CTE
- High adhesion to various substrates
Product selector guide
Anti-bleed Additive
| Product | Chemistry/Description | Application/Features |
| A1050 | Antibleed Additive | Non halogenated |
Superior compatibility with metal filler systems such as silver. Improved bleeding properties: Non-metal filled systems ex. silica |
| A1100 | Antibleed Additive | Non halogenated | Designed for metal surfaces with more acid functionality. Improved bleeding properties: Non-metal filled systems ex. silica Recommended formulation: 0.5% - 1.0% |
| A6225 | Antibleed Additive | Non halogenated | Universal additive | Excellent compatibility: Silver Improved bleeding properties: Non-metal filled systems ex. silica It also provide mold release and surface atnti stiction properties. Recommended formulation: 2% - 4% |
| A6280 | Antibleed Additive | Non halogenated |
Excellent compatibility: Gold surfaces Designed for Non-metal filled systems Minimal or no affect on the adhesion properties of the formulation.Recommended formulation: 0.5% - 1.0% |
| A6165 | Electrical Conductivity Enhancer |
Use as an additive in combination with metal fillers (e.g. silver or Ag coated Cu) to further |
Adhesion Promoter Additive
| Product | Chemistry/Description | Application/Features |
| A304 | 4-Meta (Methacryloxyethyl trimellitic anhydride) Adhesion Promoter Additive |
Reactive Primer specific for dental application Enhance monomer penetration into dentin pretreated with 10% citric acid and 3% ferric chloride |
| A478-M | PMDM-M (Pyromellitic Dianhydride Dimethacrylate) Adhesion Promoter Additive | PMDM-M chemistry is a cheaper option for dental adhesive application |
| A675-100 | PMDGM (Pyromellitic Dianhydride Glycerol Dimethacrylate Adduct) Adhesion Promoter Additive | Adhesion enhancement where four methacrylate groups and two carboxylic groups per molecule allow bonding to a variety surfaces. |
| MM211 | Maleimide Adhesion Promoter Additive | Flexible Aliphatic backbone | Use as intermediate for the synthesis of ester and amide linked thermoset monomers, as well as maleimide functional resins |
| MM281 | Maleimide Adhesion Promoter Additive | Flexible Aliphatic backbone | Long Aklyl Chain | Main difference from MM211 is the twice as long alkyl chain |
| MM290 | Acrylate Adhesion Promoter | Use in UV or peroxide cure formulations and applications that require hydrolytic resistance | Mild odor |
| MM304 | Methacrylate adhesion promoter Additive | Use as a reactive diluent monomer for use in UV or peroxide cure formulations. |
Base Resin
| Product | Chemistry/Description | Application/Features |
| PEAM-1044 | Low warpage Polyester Acrylate/Methacrylate | High thermal stability and low volatility | Use as a base resin in a formulation or an additive | Exceptionally low warpage with the addition of polybutadiene type resins |
| PEAM-1769 | Difunctional (meth)acrylate | Use as a base resin or an additive to reduce stress | Excellent adhesion on most substrates with low stress and low shrinkage due to its high Tg polycyclic repeat units. |
| PEAM-645 | High Tg Polyester Acrylate/Methacrylate | Use as a base resin in adhesive applications or coating applications | Exhibits low CTE, high Tg, and high modulus. |
| PEM-665 | Methacrylate terminated polyester | Use as a base resin in dental applications | Good solubility in both aliphatic and aromatic co-monomers. |
Universal Additive
| Product | Chemistry/Description | Application/Features |
| Benzimidazole | Benzimidazole | Latent curing Agent For Epoxy Resins | Reacts at elevated temperatures makes it ideal for enhancing the thermal stability and mechanical properties of epoxy mold compounds. |
| CHEMLINQ AL20-2B | Triethylenetetramine (TETA) | Corrosion Inhibitor | Accelerate Curing Process | Fuel Additive | Premier epoxy curing agent that accelerates the curing process and can produce durable coatings in adhesives, composites, and coatings |
| CS-697 | Polyglycidyl Ether Cyclosiloxane | For Adhesive formulation base resin with compatibility with most organic resins. |
| CS-783 | Methacrylated, Epoxy-functional Hybrid Cyclosiloxane Monomer Adhesion Enhancer Additive | Used primarily as an adhesion promoter for mold compounds, metal surfaces, and polyimides by improving interfacial bonding |
| Dow Corning Toray SF-8421 | EG Fluid | EMC Internal Release Agent Additive | Formulated for compatibility with EMC wherein the main purpose is to reduce stress and improve flowability of the mold compound | Excellent compatibility with epoxies and silicones |
| MM204 | High Tg Mono-Functional Acrylate Monomer | Use as a reactive diluent for UV or peroxide cured resins, coatings or adhesives | Improve stereolithographic processes for high-temperature applications. |
| MM220 | Low viscosity mono-acrylate monomer | Use as reactive diluent for UV or peroxide cured resins, coatings and adhesives | Polycyclic ring structure helps minimize shrinkage on cure |
| U-847 | high-purity, methacrylate-modified urethane monomeR | Use in advanced light-cure formulations | No BPA backbone |





















